Employed by / Works For: School of Packaging
Nick Heslip is a Principal Project Engineer in Medtronic’s Cardio-Vascular Packaging and Labeling organization. His group works to advance the use of new or novel designs, materials and processes enhancing sterile barrier protection, user functionality, and pack-out and logistics efficiencies. He has 10 years of experience working in various roles including Packaging Engineer, Manufacturing Engineer, Manufacturing Group Leader and currently Project Engineer. Nick has held these roles in various industries such as dental supplies/devices, pharmaceuticals and medical devices (cardiovascular and orthopedic). He holds a BS in Packaging from Michigan State University and a MBA from Ball State’s Miller College of Business.